Ultrasonic dot soldering and CERARIBBON dot bonding tool USK-Dot-1200/6000
Introduction
When attaching electrodes to crystalline wafer substrates or thin-film amorphous silicon substrates, which have low resistance among solar cells, dot soldering of about φ2mm may be used instead of line soldering to reduce material costs.
Characteristics
CERASOLZER
World’s only alloy enabling soldering to glass.
SUNBONDER
Compact ultrasonic soldering device that can remove oxide film without flux.
CERARIBBON
Electrode wiring coated with CERASOLZER, which has good bonding compatibility with CERASOLZER.
Labeler
Supplying tape to fix electrodes to the junction box on the back of the solar cell.
Automation
technologyApplying HDD assembly automation technology, which we have been developed over 40 years, to ultrasonic soldering.
Bonding
processOne stop solution for all the technologies of materials, ultrasonic wave, automation equipment. We can even propose processes.
This product solves these problems
Our ultrasonic soldering tools can perform ultrasonic soldering operations simultaneously with up to 8 heads. In contrast to ultrasonic line soldering, ultrasonic dot soldering requires a longer tact time, but by increasing the number of units that perform ultrasonic soldering simultaneously, the tact time can be shortened.
Results and experience
| Optical fiber ferrule bonding | By soldering to the optical fiber, it is used for bonding with the ferrule. |
|---|---|
| LCOS electrode wiring | It can draw about 20mm solder line with the amount of solder on the iron tip. |
| Desktop ultrasonic soldering device | Soldering can be done freely on an area of about X:300mm/Y:300mm. |
Solderable material
Compatible with low-solderability materials, such as glass, ceramic, stainless steel, and superconductor wire.
For details, please refer to “Solderable material list“.
Specification
Ultrasonic Dot Soldering tool for PV
USK-Dot-1200
| Application | Glass dot soldering |
|---|---|
| Overview | Pre-supplying solder to the tip of the iron and soldering the object. |
| Workpiece | Glass substrate □300mm |
| Ultrasonic wave | 60kHz |
| Soldering material | CERASOLZER ECO #217 (Pb-free melting point 217℃) |
| Characteristics | Soldering position can be set visually. |
Ultrasonic Line Soldering and ribbon bonding tool for PV
USK-Line-8500
| Application | Amorphous silicon solar cells |
|---|---|
| Overview | Pre-supplying solder to the tip of the iron and soldering the object, then bonding copper flat wire. |
| Workpiece | Glass substrate □500mm |
| Ultrasonic wave | 60kHz |
| Soldering material | CERASOLZER ECO #217 (Pb-free melting point 217℃) |
| Characteristics | Mass production tool for electrode wiring with transfer function, high speed tact by 8 heads simultaneous operation. |
From agreement to delivery: flow
Delivery takes approximately 2 to 9 months after receipt of order, depending on the volume of the device.
1.Inquiry (perform sample test, etc. as needed.)
2.Meeting (we will ask you what kind of equipment you need)
3.Proposal and quotation (proposal of process and equipment specification)
4.Order
5.Design, material arrangement, manufacturing, and adjustment
6.Onsite customer acceptance inspection and training.
7.Packing and shipping
8.Installation, adjustment, and flow operation confirmation