Ultrasonic Round Target Bonding tool USK-Bonding-1200
Introduction
Ultrasonic soldering has become the industry standard for bonding sputtering targets.
More than 20 years ago, in response to a request from a target material manufacturer, we started developing and proposing a process for applying indium to the base material by ultrasonic soldering.
At that time, the proposal was manual iron, but as spatter targets for smartphones and televisions were growing, the needs for automation equipment were increasing.
Characteristics
Planer
target
coatingUltrasonic soldering on a flat base metal
Round
target
coatingUltrasonic soldering while rotating a disk-shaped base material
Rotary
target
coatingInserting an ultrasonic soldering iron inside a rotary
Automation
lineAutomatically handles everything from preheating of base metal and back plate to ultrasonic soldering and bonding
This product solves these problems
By automating the work that operators have done manually, the system will handle 24 hours production, stabilize quality, and increase production volumes.
Results and experience
| Planer target | Coating the entire surface by moving the iron freely in the XY plane. |
|---|---|
| Rotary target | Coating the inside of the rotary target by inserting the soldering iron into the rotary. |
Solderable materials
The following materials can be soldered with this product.
- Titanium(Ti)
- Copper(Cu)
- Silver(Ag)
- Gold(Au)
- Platinum(Pt)
- Indium(In)
- Nickel(Ni)
- Chromium(Cr)
- Cobalt(Co)
- Tantalum(Ta)
- Molybdenum(Mo)
- Cu-Al alloy
- Mn alloy
- Ni alloy
- Co alloy
- Cr alloy
- Zirconium
- Hafnium
- Mullite
- Rhodium
- Palladium
- ITO
- Alumina(Al2O3)
- CaO
- MgO
- SiO2
- TiO2
- ZnO
- ZrO2
- CeO2
- Si3N3
Specification
Ultrasonic Circular Target Bonding tool
USK-Bonding-1200
| Application | Sputtering target |
|---|---|
| Overview | Coating the entire surface of the disk-shaped target material with indium |
| Workpiece | Target material Φ300mm |
| Ultrasonic wave | 20kHz |
| Soldering material | Indium |
| Characteristics | Coating the entire surface while preheating and rotating the disks |
Ultrasonic Planer Target Bonding tool
USK-Bonding-2000
| Application | Sputtering target |
|---|---|
| Overview | Coating the entire surface of the target material with indium |
| Workpiece | Target material 100mm×300mm |
| Ultrasonic wave | 28kHz |
| Soldering material | Indium |
| Characteristics | Mass production tool with two stages that allows setup even during coating |
From agreement to delivery: flow
Delivery takes approximately 2 to 9 months after ordering, depending on the volume of the device.
1.Inquiry (perform sample test, etc. as needed.)
2.Meeting (we will ask you what kind of equipment you need)
3.Proposal and quotation (proposal of process and equipment specification)
4.Order
5.Design, material arrangement, manufacturing, and adjustment
6.Onsite customer acceptance inspection and training.
7.Packing and shipping
8.Installation, adjustment, and flow operation confirmation